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SEMiX355MLI12M7

$0.00

Chip Technology: IGBT M7; Current (A): 350 A; Dimensions (LLxBBxHH) mm: 130x70x17; Features: Solderless assembling solution with PressFIT signal pins and screw power terminals, Trenchgate Technology, VCE(sat) with positive temperature coefficient, Low inductance case, Reliable mechanical design with injection moulded terminals and reliable internal connections, UL recognized file no. E63532, NTC temperature sensor inside; Housing: SEMiX 5p; Part Number: 27922120; Product Line: SEMiX; Product Status: In production new; Product Type: SEMiX355MLI12M7; Switches: 3-Level; Technology: IGBT; Typical Applications: UPS, Solar; Voltage (V): 1200 V; Product Line: SEMiX; Product Description: SEMiX 5p

SKU: SEMiX355MLI12M7 Categories: , Tag:

Description

Chip Technology: IGBT M7; Current (A): 350 A; Dimensions (LLxBBxHH) mm: 130x70x17; Features: Solderless assembling solution with PressFIT signal pins and screw power terminals, Trenchgate Technology, VCE(sat) with positive temperature coefficient, Low inductance case, Reliable mechanical design with injection moulded terminals and reliable internal connections, UL recognized file no. E63532, NTC temperature sensor inside; Housing: SEMiX 5p; Part Number: 27922120; Product Line: SEMiX; Product Status: In production new; Product Type: SEMiX355MLI12M7; Switches: 3-Level; Technology: IGBT; Typical Applications: UPS, Solar; Voltage (V): 1200 V; Product Line: SEMiX; Product Description: SEMiX 5p

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