SEMiX305TMLI17E4CV1
$0.00
Chip Technology: IGBT 4 (Trench); Current (A): 300 A; Dimensions (LLxBBxHH) mm: 130x70x17; Features: Solderless assembling solution with PressFIT signal pins and screw power terminals, IGBT 4 Trench Gate Technology, VCE(sat) with positive temperature coefficient, Low inductance case, Reliable mechanical design with injection moulded terminals and reliable internal connections, UL recognized file no. E63532, NTC temperature sensor inside; Housing: SEMiX 5p; Part Number: 27923040; Product Line: SEMiX; Product Status: In production new; Product Type: SEMiX305TMLI17E4CV1; Switches: 3-Level; Technology: IGBT; Typical Applications: UPS, Solar, Motor drives; Voltage (V): 1700 V; Product Line: SEMiX; Product Description: SEMiX 5p
Description
Chip Technology: IGBT 4 (Trench); Current (A): 300 A; Dimensions (LLxBBxHH) mm: 130x70x17; Features: Solderless assembling solution with PressFIT signal pins and screw power terminals, IGBT 4 Trench Gate Technology, VCE(sat) with positive temperature coefficient, Low inductance case, Reliable mechanical design with injection moulded terminals and reliable internal connections, UL recognized file no. E63532, NTC temperature sensor inside; Housing: SEMiX 5p; Part Number: 27923040; Product Line: SEMiX; Product Status: In production new; Product Type: SEMiX305TMLI17E4CV1; Switches: 3-Level; Technology: IGBT; Typical Applications: UPS, Solar, Motor drives; Voltage (V): 1700 V; Product Line: SEMiX; Product Description: SEMiX 5p