Reference Only
CPD63-1N3064
Mounting: Bare die; Case: Chip_Packaging; Configuration/: Bare die 11.020 X 11.020; VRRM(max): 75V; Io(max): 75mA; IFSM(max): 2A; IR(max): 100nA; @VR: 50V; VF(max): 575mV; @IF: 250μA; trr(typ)in ns: - ; trr(max)in ns: 4ns; CJ(typ)in pF: - ; CJ(max)in pF: 2pF
Product Description
Mounting: Bare die; Case: Chip_Packaging; Configuration/: Bare die 11.020 X 11.020; VRRM(max): 75V; Io(max): 75mA; IFSM(max): 2A; IR(max): 100nA; @VR: 50V; VF(max): 575mV; @IF: 250μA; trr(typ)in ns: - ; trr(max)in ns: 4ns; CJ(typ)in pF: - ; CJ(max)in pF: 2pF