The VFSGBN-150150010-00 heatsink, manufactured by ASSMANN WSW, is designed for BGA components requiring efficient thermal management. With dimensions of 15x15x10mm, this compact heatsink provides a reliable cooling solution to prevent overheating and maintain optimal performance. Its design ensures effective heat dissipation, extending the lifespan of your valuable electronic components. Supreme Components International is an authorised distributor of ASSMANN WSW, ensuring you receive genuine, high-quality products. This heatsink is suitable for a wide range of applications, including microprocessors, memory chips, and other heat-sensitive devices. Trust ASSMANN WSW and Supreme Components International for your thermal management needs.
Product Categories
Thermal foil
Thermal Management
Specifications
| Parameter | Value |
|---|---|
| Width | 15 millimeters |
| Height | 10 millimeters |
| Length | 15 millimeters |
| Heatsinktype | Ball Grid Array |