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VFSBBN-150150015-00

VFSBBN-150150015-00

Heatsink for BGA packages, dimensions 15x15x15mm, with black anodized finish.

The VFSBBN-150150015-00 is a BGA heatsink manufactured by ASSMANN WSW, available through Supreme Components International, an authorised distributor of electronic components. This heatsink is specifically designed to provide efficient thermal management for BGA (Ball Grid Array) components. With dimensions of 15x15x15mm, it's suitable for a wide range of applications where space is a constraint. The black anodized finish not only enhances its appearance but also provides added protection against corrosion and wear. Proper heat dissipation is crucial for maintaining the performance and reliability of electronic devices, and this heatsink is engineered to effectively draw heat away from sensitive components, preventing overheating and potential damage. Choose Supreme Components International for genuine ASSMANN WSW products and expert support.

Product Categories

Thermal foil Thermal Management

Specifications

Parameter Value
Finish Black Anodized
Material Aluminum
Dimensions 15 x 15 x 15 millimeters
Heatsinktype Ball Grid Array
Attachmentmethod Adhesive

Datasheet

Download Datasheet

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