TPL-800-21BKM-30

Type: Film structure - Film (Single-layer); Thickness: 30μm; Appearance: Visual inspection - Black matte; Exposure dose: Lamp DI, mJ/cm² - 100 (ST 6); Pencil hardness: JIS K5400 - 2-3H; Adhesion after post-curing: kapton100H (25μm) - 100/100, FCCLCu12/PI25) on Cu side - 100/100; Warpage: kapton100H (25μm) 20×25mm - 2～3mm; Bending (Flexibility): MIT test - Radius=0.38mm, 135°, 175cpm, 4.9N Load, FCCL: RA L/S=100/100 (single side) - 150 - 200 times; Mechanical strength: Breaking Strength (MPa) - 20 – 30; Elongation (%) - 50 – 60; Elastic modulus (GPa) - 0.7 - 1.0; ENIG resistance: Ni:6μm Au:0.05μm - No peeling; Hot Bar resistance: 320°C 8sec, Flux OM338, every time apply (0.010mg/dot) - 20 times over; Flux resistance (Flux pool): Flux OM340, Height 0.15mm, 260°C peak Reflow (CZ 1.0μm) - PASS; B HAST: 110°C-85% 32V 24h L/S=30μm/30μm - >1.0E+8Ω; HHBT with EMI shield film: EMI Shield Film, L/S=25/25, 85°C 85%RH, After 100V, 96h and 50V, 404h - >1.0E+6Ω, Clear; On Cu 20-25μm; Flame retardancy: UL94 standard - VTM-0