Ti60F225C3L
Efinix Titanium Ti60 FPGA, 225 Ball FBGA
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Product Description
Supreme Components International, an authorised distributor, presents the Efinix Ti60F225C3L, a cutting-edge FPGA from the Titanium family. This FPGA is housed in a compact 225-ball FBGA package, making it suitable for space-constrained applications. The Titanium family is known for its superior performance, low power consumption, and reconfigurability. The Ti60 FPGA offers a flexible platform for implementing custom logic, accelerating algorithms, and prototyping new designs. It is well-suited for applications in embedded systems, industrial automation, and communication infrastructure. Benefit from Efinix's innovative architecture and Supreme Components International's reliable supply chain.
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Technical Specifications
| Package type | 225 Fine-Pitch Ball Grid Array |
|---|---|
| Logic elements | 59000 |
| Input output pins | 184 |
| Random access memory | 4.5 Megabytes |
| Serializer deserializer channels | 16 |
| Peripheral component interconnect express | Yes |
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