Ti60F225C3
Efinix Titanium Ti60 FPGA in 225 Ball FBGA package.
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Product Description
The Efinix Ti60F225C3 FPGA is a member of the Titanium family, known for its power efficiency and high performance. This FPGA is housed in a 225 Ball FBGA package, making it suitable for a variety of embedded applications. Supreme Components International is an authorised distributor of Efinix products, ensuring you receive genuine components with full manufacturer support. The Titanium architecture allows for flexible hardware acceleration and custom logic implementation. This FPGA is well-suited for applications in areas such as industrial automation, edge computing, and communication systems. Benefit from its reconfigurability and low power consumption to create innovative solutions. Contact us for more information and volume pricing.
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Technical Specifications
| Package type | FBGA-225 |
|---|---|
| Input output signals | 184 |
| Logic elements count | 59000 |
| Random access memory | 4.5 Megabytes |
| Operating temperature range | -40 Degrees Celsius to +100 Degrees Celsius |
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