Semikron

IGBT 4 (Trench) 420 A 160x150x35 IGBT 4 Trench Gate Technology, Solderless sinter technology, V_CE(sat) with positive temperature coefficient, Low inductance case, Insulated by Al₂O₃ DBC (Direct Bonded Copper) ceramic substrate, Pressure contact technology for thermal contacts, Spring contact system to attach driver PCB to the control terminals, High short circuit capability, self limiting to 6 x I_C, Integrated temperature sensor, Improved power cycle capability of diodes due to AlCu-bond wires SKiM 93 23930400 SKiM In production new SKiM429GD17E4V5 Sixpack IGBT Automotive inverter, High reliability AC inverter wind, High reliability AC inverter drives 1700 V SKiM 93