SK25DGDL12T7ETE1s
$0.00
Chip Technology: IGBT T7; Current (A): 25 A; Dimensions (LLxBBxHH) mm: 63x34x12; Features: Optimized design for superior thermal performance, Low inductive design, Solder contact technology, 1200V Generation 7 IGBT (T7), Robust and soft switching CAL4F diode technology, PEP rectifier diode technology for enhanced power and environmental robustness, Integrated NTC temperature sensor, UL recognized file no. E 63 532; Housing: SEMITOP E1 Solder; Part Number: 24922950; Product Line: SEMITOP; Product Status: In production new; Product Type: SK25DGDL12T7ETE1s; Switches: CIB; Technology: IGBT; Typical Applications: Motor drives, Air conditioning, Auxiliary Inverters; Voltage (V): 1200 V; Product Line: SEMITOP; Product Description: SEMITOP E1 Solder
Description
Chip Technology: IGBT T7; Current (A): 25 A; Dimensions (LLxBBxHH) mm: 63x34x12; Features: Optimized design for superior thermal performance, Low inductive design, Solder contact technology, 1200V Generation 7 IGBT (T7), Robust and soft switching CAL4F diode technology, PEP rectifier diode technology for enhanced power and environmental robustness, Integrated NTC temperature sensor, UL recognized file no. E 63 532; Housing: SEMITOP E1 Solder; Part Number: 24922950; Product Line: SEMITOP; Product Status: In production new; Product Type: SK25DGDL12T7ETE1s; Switches: CIB; Technology: IGBT; Typical Applications: Motor drives, Air conditioning, Auxiliary Inverters; Voltage (V): 1200 V; Product Line: SEMITOP; Product Description: SEMITOP E1 Solder