SK 50 GBB 066 T
IGBT 3 (Trench) 50 A 55x31x12 Compact design, One scre mounting, Heat transfer and isolation trough direct copper bonded aluminium oxide ceramic (DCB), Trench IGBT technology, CAL HD technology FWD, Integrated NTC temperature sensor SEMITOP 3 24914750 SEMITOP In production SK 50 GBB 066 T H-Bridge IGBT 600 V SEMITOP 3
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Power Modules
Power Modules by Chip Technology - IGBT Modules
Power Modules
Power Modules by Chip Technology - IGBT Modules