SK 150 MLI 07F3 TD1p
$0.00
Chip Technology: IGBT 3 (Trench); Current (A): 150 A; Dimensions (LLxBBxHH) mm: 61x55x12; Features: One screw mounting module, Solder free mounting with Press-Fit terminals, Fully compatible with other SEMITOP® Press-Fit types, Improved thermal performances by aluminium oxide substrate, 650V Trench IGBT technology, CAL4F technology FWD, Rapid switching clamping diode technology, Integrated NTC temperature sensor, UL recognized, file no. E 63 532; Housing: SEMITOP 4 Press-Fit; Part Number: 24920071; Product Line: SEMITOP; Product Status: In production; Product Type: SK 150 MLI 07F3 TD1p; Switches: 3-Level; Technology: IGBT; Typical Applications: UPS, Solar; Voltage (V): 650 V; Product Line: SEMITOP; Product Description: SEMITOP 4 Press-Fit
Description
Chip Technology: IGBT 3 (Trench); Current (A): 150 A; Dimensions (LLxBBxHH) mm: 61x55x12; Features: One screw mounting module, Solder free mounting with Press-Fit terminals, Fully compatible with other SEMITOP® Press-Fit types, Improved thermal performances by aluminium oxide substrate, 650V Trench IGBT technology, CAL4F technology FWD, Rapid switching clamping diode technology, Integrated NTC temperature sensor, UL recognized, file no. E 63 532; Housing: SEMITOP 4 Press-Fit; Part Number: 24920071; Product Line: SEMITOP; Product Status: In production; Product Type: SK 150 MLI 07F3 TD1p; Switches: 3-Level; Technology: IGBT; Typical Applications: UPS, Solar; Voltage (V): 650 V; Product Line: SEMITOP; Product Description: SEMITOP 4 Press-Fit