HSS21-B20-P53

Reference Only

HSS21-B20-P53

heat sink, stamping, TO-218/TO-220, 24.4 x 25.4 x 12.7 mm, solder pin

Category:
Thermal Management
Sub Category:
Fans & Blowers
Same Sky (formerly CUI Devices)

Product Description

heat sink, stamping, TO-218/TO-220, 24.4 x 25.4 x 12.7 mm, solder pin

Product Tags

Technical Specifications

Attribute Description
Dimensions LxWxH (in) 0.96 x 1 x 0.5
Dimensions LxWxH (mm) 24.4 x 25.4 x 12.7
Heat Sink Type Board Level
Height (mm) Stamped
Length (mm) 12.7
Material 24.4
Material Finish AL1050
Mounting Style Black Anodized
Package Cooled PCB
Power Dissipation @ 75°C ΔT TO-218
nat conv (W) TO-220
Solder Pin Length (mm) 3.58
Solder Pin Orientation 5.3
Thermal Resistance @ 1 W 20.93
200 LFM (°C/W) 10.1
400 LFM (°C/W) 24.3
nat conv (°C/W) 25.4
This is a staging environment

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