HSS08-B18-CP

Reference Only

HSS08-B18-CP

heat sink, stamping, TO-218, 44.45 x 44.45 x 12.5 mm, clip

Category:
Thermal Management
Sub Category:
Fans & Blowers
Same Sky (formerly CUI Devices)

Product Description

heat sink, stamping, TO-218, 44.45 x 44.45 x 12.5 mm, clip

Product Tags

Technical Specifications

Attribute Description
Dimensions LxWxH (in) 1.75 x 1.75 x 0.49
Dimensions LxWxH (mm) 44.45 x 44.45 x 12.5
Heat Sink Type Board Level
Height (mm) Stamped
Length (mm) 12.5
Material 44.45
Material Finish AL1050
Mounting Style Black Anodized
Package Cooled PCB
Power Dissipation @ 75°C ΔT TO-218
nat conv (W) 10.29
Solder Pin Length (mm) 2.54
Solder Pin Orientation Horizontal
Thermal Resistance @ 1 W 44.45
200 LFM (°C/W) 3
400 LFM (°C/W) 7.29
This is a staging environment

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