Reference Only
HSB39-252509P
heat sink, BGA, 25 x 25 x 9 mm, 2 push pins w/ flange
Manufacturer:
Same Sky (formerly CUI Devices)Category:
Thermal Management
Sub Category:
Fans & Blowers
Product Description
heat sink, BGA, 25 x 25 x 9 mm, 2 push pins w/ flange
Technical Specifications
| Attribute | Description |
|---|---|
| Dimensions LxWxH (in) | 0.984 x 0.984 x 0.354 |
| Dimensions LxWxH (mm) | 25 x 25 x 9 |
| Heat Sink Type | BGA |
| Height (mm) | Extruded |
| Length (mm) | 9 |
| Material | 25 |
| Material Finish | AL6063-T5 |
| Mounting Style | Black Anodized |
| Package Cooled | PCB |
| Power Dissipation @ 75°C ΔT | Not Applicable |
| nat conv (W) | 4.28 |
| Solder Pin Orientation | No Pin |
| Thermal Pad | No |
| Thermal Resistance @ 1 W | 25 |
| 200 LFM (°C/W) | 4.3 |
| 400 LFM (°C/W) | 17.53 |