Reference Only
HSB23-232325
heat sink, BGA, 23 x 23 x 25 mm
Manufacturer:
Same Sky (formerly CUI Devices)Category:
Thermal Management
Sub Category:
Fans & Blowers
Product Description
heat sink, BGA, 23 x 23 x 25 mm
Technical Specifications
| Attribute | Description |
|---|---|
| Dimensions LxWxH (in) | 0.91 x 0.91 x 0.98 |
| Dimensions LxWxH (mm) | 23 x 23 x 25 |
| Heat Sink Type | BGA |
| Height (mm) | Extruded |
| Length (mm) | 25 |
| Material | 23 |
| Material Finish | AL6063-T5 |
| Mounting Style | Black Anodized |
| Package Cooled | PCB |
| Power Dissipation @ 75°C ΔT | Not Applicable |
| nat conv (W) | 6.13 |
| Solder Pin Orientation | No Pin |
| Thermal Resistance @ 1 W | 23 |
| 200 LFM (°C/W) | 2.4 |
| 400 LFM (°C/W) | 12.23 |