HSB01-080808

Reference Only

HSB01-080808

heat sink, BGA, 8.5 x 8.5 x 8 mm

Category:
Thermal Management
Sub Category:
Fans & Blowers
Same Sky (formerly CUI Devices)

Product Description

heat sink, BGA, 8.5 x 8.5 x 8 mm

Product Tags

Technical Specifications

Attribute Description
Dimensions LxWxH (in) 0.33 x 0.33 x 0.31
Dimensions LxWxH (mm) 8.5 x 8.5 x 8
Heat Sink Type BGA
Height (mm) Extruded
Length (mm) 8
Material 8.5
Material Finish AL6063-T5
Mounting Style Black Anodized
Package Cooled Adhesive
Power Dissipation @ 75°C ΔT Not Applicable
nat conv (W) 1.92
Solder Pin Orientation No Pin
Thermal Resistance @ 1 W 8.5
200 LFM (°C/W) 11.2
400 LFM (°C/W) 39.1
This is a staging environment

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