
CPD77-1N5820
$0.00
Mounting: Bare die; Case: Chip_Packaging; Configuration/: Bare die 60.630 X 60.630; VRRM(max): 20V; Io(max): 3A; IFSM(max): 80A; IR(max): 2mA; @VR: 20V; VF(max): 475mV; @IF: 3A; trr(typ)in ns: – ; trr(max)in ns: – ; CJ(typ)in pF: – ; CJ(max)in pF: –
Description
Mounting: Bare die; Case: Chip_Packaging; Configuration/: Bare die 60.630 X 60.630; VRRM(max): 20V; Io(max): 3A; IFSM(max): 80A; IR(max): 2mA; @VR: 20V; VF(max): 475mV; @IF: 3A; trr(typ)in ns: – ; trr(max)in ns: – ; CJ(typ)in pF: – ; CJ(max)in pF: –