CPD69-1N5614
$0.00
Mounting: Bare die; Case: Chip_Packaging; Configuration/: Bare die 42.500 X 42.500; VRRM(max): 200V; Io(max): 1A; IFSM(max): 40A; IR(max): 500nA; @VR: 200V; VF(max): 1.2V; @IF: 1A; trr(typ)in ns: – ; trr(max)in ns: 2μs; CJ(typ)in pF: – ; CJ(max)in pF: 35pF
Description
Mounting: Bare die; Case: Chip_Packaging; Configuration/: Bare die 42.500 X 42.500; VRRM(max): 200V; Io(max): 1A; IFSM(max): 40A; IR(max): 500nA; @VR: 200V; VF(max): 1.2V; @IF: 1A; trr(typ)in ns: – ; trr(max)in ns: 2μs; CJ(typ)in pF: – ; CJ(max)in pF: 35pF