
ASFC4G31M-51BIN
$0.00
DENSITY: 4GB; Bus Width: x8; VCC: 2.7 ~ 3.6V; NAND Type: MLC; MMC Interface: 5.1; Temperature: -40°C ~ 85°C; PACKAGES: 153ball FBGA (11.5 x 13mm); Documentation: Reliability/ MDS
Description
DENSITY: 4GB; Bus Width: x8; VCC: 2.7 ~ 3.6V; NAND Type: MLC; MMC Interface: 5.1; Temperature: -40°C ~ 85°C; PACKAGES: 153ball FBGA (11.5 x 13mm); Documentation: Reliability/ MDS