ASFC16G31M-51BIN

$0.00

DENSITY: 16GB; Bus Width: x8; VCC: 2.7 ~ 3.6V; NAND Type: MLC; MMC Interface: 5.1; Temperature: -40°C ~ 85°C; PACKAGES: 153ball FBGA (11.5 x 13mm); Documentation: Reliability/ MDS

Description

DENSITY: 16GB; Bus Width: x8; VCC: 2.7 ~ 3.6V; NAND Type: MLC; MMC Interface: 5.1; Temperature: -40°C ~ 85°C; PACKAGES: 153ball FBGA (11.5 x 13mm); Documentation: Reliability/ MDS

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