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AK-PAX-1
High performance thermal interface compound for efficient heat transfer.
Product Description
The Akasa AK-PAX-1 is a high-performance thermal interface compound meticulously engineered to facilitate efficient heat transfer. This thermal paste effectively bridges the microscopic gaps between the heat source (CPU, GPU, or other components) and the heatsink, maximizing thermal conductivity and minimizing thermal resistance. Its advanced formulation ensures optimal performance, even under demanding conditions. Supreme Components International is an authorised distributor of Akasa products, guaranteeing authenticity and quality. The AK-PAX-1 is easy to apply, non-curing, and provides long-lasting thermal stability. It's an excellent choice for overclockers, gamers, and anyone seeking to improve the cooling efficiency of their system. Enhance your system's performance and longevity with Akasa's trusted thermal solutions. This product is essential for maintaining optimal operating temperatures and preventing overheating.
Technical Specifications
| Attribute | Description |
|---|---|
| Volume | 1.5 grams |
| Viscosity | 73 centipoise |
| Specific Gravity | Greater than 2.0 grams per cubic centimeter |
| Thermal Impedance | Less than 0.255 degrees Celsius-square inches per Watt |
| Dielectric Constant | 5.1 |
| Thermal Conductivity | 0.84 Watts per meter-Kelvin |
| Operating Temperature | Negative 50 degrees Celsius to 240 degrees Celsius |
Ordering Information
| Attribute | Description |
|---|---|
| WEIGHT | 1.5g |
| Packaging Type | SYRINGE |