5088
$0.00
Title: High Speed SMT Board-to-Board Connectors 0.8mm Pitch, Mating Height 5mm; Insulator: Thermoplastic, UL94 V-0, black; Contact Material: Copper alloy; Contact Surface: Terminals (mating side): 0,2µm Au over Ni Ground plane (mating side): 0,38µm Au over Ni Solder side pins and ground plane: flash Au over Ni; Contact Resistance: < 15 mΩ; Insulation Resistance: > 5 GΩ; Test Voltage: 675 V AC; Voltage Rating: 225 V AC; Current Rating: Terminals: 2 A Ground Plane: 7.8 A; Temperature Range: -55 °C … +125 °C; Mechanical Life: 100 mating cycles; Processing: 260 °C for 5s max.
Description
Title: High Speed SMT Board-to-Board Connectors 0.8mm Pitch, Mating Height 5mm; Insulator: Thermoplastic, UL94 V-0, black; Contact Material: Copper alloy; Contact Surface: Terminals (mating side): 0,2µm Au over Ni Ground plane (mating side): 0,38µm Au over Ni Solder side pins and ground plane: flash Au over Ni; Contact Resistance: < 15 mΩ; Insulation Resistance: > 5 GΩ; Test Voltage: 675 V AC; Voltage Rating: 225 V AC; Current Rating: Terminals: 2 A Ground Plane: 7.8 A; Temperature Range: -55 °C … +125 °C; Mechanical Life: 100 mating cycles; Processing: 260 °C for 5s max.