1C6130

Parameter Value
Pd Max.@8/20us (W) 500
Chip Size (mil) 90
VRWM?V? 76
VBR Min.@ IBR(V) 90
IBR (mA) 12
IR Max. @VRWM (?A) 1
VC Max. @Ipp 144.1
IPP @10/1000us (A) 3.5
? VBR Max.(%/oC) 0.1
Part Status Active

Product Categories:

TVS Die-GPP
Wafer Dice And Flip Chip

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